Viscoplastic Creep in Solder Joints
Application ID: 4488
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations.
The model geometry includes two electronic components (chips) mounted on a circuit board by means of several solder ball joints. Significant plastic flow clearly appears after about 40 s of the loading.