Viscoplastic Creep in Solder Joints
Application ID: 4488
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations.
The geometry includes two electronic components (chips) mounted on a circuit board by means of several solder ball joints. Significant plastic flow appears after about 40 s of thermal loading.
This model example illustrates applications of this type that would nominally be built using the following products:Nonlinear Structural Materials Module
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- Nonlinear Structural Materials Module and
- either the MEMS Module, or Structural Mechanics Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Tabella delle Funzionalità and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.