Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.
Visualizza gli articoli presentati alla COMSOL Conference 2020
Improving the Performance of Hearing Aids Using Acoustic Simulations
In modern hearing aids, the performance of directional microphone systems is dependent on both the acoustics around thehearing aid and on the specific signal processing algorithms. The sound pressure at the microphone inlets depends on microphone location in the hearing-aid shell, the ... Per saperne di più
Modelling of Melt Cast Cooling and Solidification Processes for Explosives
A solidification process of casting explosives in shell is studied in this paper. An enthalpy method approach is used to model the solidification process. Both the thermal and mechanical effects are taken into account. An ALE (Arbitrary Lagrangian-Eulerian) method is used to represent ... Per saperne di più
Modeling the Rheology of Liquid Detergents
Outline of presentation: Comsol is a very flexible platform, ideal to model rheology modification under flow Analogy with reactive flows allows modeling of both thixotropy and gelation with decent level of accuracy and predictability It is possible, to a certain extent, to use 1D ... Per saperne di più
Simulation of a Multilayer Thermal Regulator for an Optical Reference
The research project under which the COMSOL simulations are performed deals with multilayer and fine thermal control of an optical reference cavity for space applications. The cavity, made of Ultra Low Expansion glass (Corning ULE), must be kept close to the zero expansion temperature of ... Per saperne di più
Analysis of Infrared Signature of a Ship Operating in MIR and FIR Bands
In this paper a methodology for calculating the infrared signature of complex objects is presented. The transient thermal analysis allows us to evaluate the temperature distribution on the investigated object, pointing out which parts tend to be warmer. These temperature values are ... Per saperne di più
Phasefield Modeling of Ferroelectric Materials
Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Per saperne di più
COMSOL Multiphysics® Version 4
Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied Mathematics from the Royal Institute of Technology in Stockholm. In 2004 he received an honorary doctoral degree from the Royal Institute of Technology. Per saperne di più
Inverse Analysis for Heat Transfer Coefficient Identification
The hot stamping of boron steels for producing complex structural components of the car body-in-white is more and more widespread. Optimization of sheet forming technologies at elevated temperatures is still troublesome, since the thermal, mechanical and metallurgical phenomena ... Per saperne di più
Oxidation of Metallic Nanoparticles
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Per saperne di più
Simulation of Daisy Chain Flip-Chip Interconnections
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Per saperne di più