La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This tutorial explores how pulse reverse plating can be used as an additive-free alternative to attenuate small protrusions during copper metal deposition. By matching the process parameters, including the length of the forward and reverse pulses (duty cycles), a bright mirror-like metal ... Per saperne di più
A Luneburg lens is a type of graded index, or GRIN lens, in which the gradient of the refractive index leads to special focusing properties. This example model uses the Geometrical Optics interface to compute the curved ray trajectories in the graded-index medium. Per saperne di più
Laser systems are an important application area in modern electronics. With nonlinear materials it is possible to generate harmonics that are a multiple of the frequency of the laser light. This model shows how a second harmonic generation can be set up as a transient wave simulation, ... Per saperne di più
This conceptual example shows how to calculate critical points in models with contact. The model consists of a block modeled with the Solid Mechanics interface pressing on an arch modeled with the Shell interface. The contact problem is solved using the augmented Lagrangian method. The ... Per saperne di più
In this example, triaxial and oedometer tests are simulated using the Hardening Soil material model. Both tests exhibit a hyperbolic stress–strain relationship. For the triaxial test, it is confirmed that the axial stress approaches the analytical failure stress asymptotically. In the ... Per saperne di più
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... Per saperne di più
Battery electrodes featuring large heterogeneities in terms of particle sizes may sometimes not be adequately described by homogenized models using one single particle size only. As an alternative to adding multiple instances of the Additional Porous Electrode material node, this ... Per saperne di più
The model is defined as a benchmark case in norm 15026:2007 annex A. The purpose of the model is to calculate the temperature and moisture profiles at different times after a change in the external conditions (temperature and relative humidity) inside a wall material (kind of concrete). ... Per saperne di più
This example model consists of a two-hot-arm thermal actuator made of polysilicon. The actuator is activated through thermal expansion. The temperature increase required to deform the arms, and thus displace the actuator, is obtained through Joule heating (resistive heating). The greater ... Per saperne di più
The dielectric shielding boundary condition is meant to approximate a thin layer of material with high relative permittivity compared to its surroundings. This boundary condition is available for electrostatic field modeling. This example compares the dielectric shielding boundary ... Per saperne di più