La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This example simulates electroplating of a printed circuit board (PCB) in 3D using the Secondary Current Distribution interface. In order to achieve thickness uniformity across the PCB, a dummy pattern is included in the design, along with an aperture in the electroplating bath. Per saperne di più
The mutual inductance and induced currents between a single turn primary and twenty turn secondary coil in a concentric coplanar arrangement is computed using a frequency domain model. The secondary coil is modeled using a homogenized approach which does not explicitly consider each turn ... Per saperne di più
Breaker and disconnector devices are widely used in AC substations in power systems.In this model, the Electrostatics Interface is used to simulate the electric potential and electric field in a 110kV 3-phase high-voltage switchgear operating at 50 Hz. A surrogate model is also trained ... Per saperne di più
This model shows how to build and solve a radiative heat transfer problem using the Heat Transfer interface. In particular, this 2D model illustrates the use of the surface-to-surface radiation feature. In this model, three surfaces form a cavity. Heat flux is set at two outer ... Per saperne di più
Trusses are commonly used to create light structures that can support heavy loads. When designing such a structure, it is important to ensure its safety. For a tower made of bars, buckling can cause the structure to collapse. This model shows how to compute the critical buckling load ... Per saperne di più
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Per saperne di più
An ion-sensitive field-effect transistor (ISFET) is constructed by replacing the gate contact of a MOSFET with an electrolyte of interest. The concentration of a specific ionic species in the electrolyte can be determined by measuring the change in the gate voltage due to the interaction ... Per saperne di più
This tutorial shows how to model a miniaturized magnetostrictive antenna developed for use inside living cells. The stress in the antenna, the magnetic flux density, the current density, and the displacement of the tip of the device are investigated at the resonance frequency. Per saperne di più
This model exemplifies how the rate of steel corrosion in an oil platform increases over time due to build-up of a resistive film on the sacrificial anodes, formed by reaction products. The model also includes secondary current distribution electrode kinetics on the protected steel ... Per saperne di più
Anti-reflective coatings are frequently used in optical systems to reduce the amount of stray light produced when a beam of light crosses from one medium into another medium with a different refractive index. The simplest example of an anti-reflective coating is a quarter-wavelength ... Per saperne di più
