Thermal Stresses in a Layered Plate
Application ID: 273
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference in coefficients of thermal expansion. A third layer, the carrier layer, is then introduced in a stress-free state. Finally, the temperature is reduced to 20 degrees C, and as a result, there are thermal stresses in all layers.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
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