Modeling of Flow Field and Abrasive Particles in Chemical Mechanical Polishing (CMP) Equipment
Application ID: 140171
Chemical mechanical polishing (CMP) is a crucial technique for surface planarization, widely used in semiconductor fabrication and optical device manufacturing.
This model approximates the flow field of the slurry using a turbulent single-phase flow model. The Frozen Rotor approach is used to model relative rotation of the polishing head. A set of massless particles are traced in the flow to approximate how the abrasive particles will redistribute themselves within the flow field.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
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