Electrodeposition of an Inductor Coil
Application ID: 12613
This example models the deposition of an inductor coil in 3D. The geometry includes the extrusion of the deposition pattern into an isolating photoresist mask, and a diffusion layer on top of the photoresist.
The mass transfer of copper ions in the electrolyte has a major impact on the deposition kinetics, resulting in higher deposition rates in the outer parts of the deposition pattern. The model is solved in a time-dependent study using a moving mesh.
This model is included as an example in the following products:Electrodeposition Module
however additional products may be needed to reproduce it. This example may be created and run using components from the following product combinations:
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Specification Chart and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.