COMSOL Multiphysics® contains many features and functionality for thermomechanical modeling. In this previously held webinar, we give a brief overview of the software and the relevant features and add-on products for simulating various types of thermomechanical modeling applications.
Additionally, we discuss important aspects of thermomechanical modeling, including modeling thermal contact, material activation, and nonlinear materials. Thereafter, we demonstrate setting up, building, and running a simulation of viscoplastic creep in solder joints. This webinar is particularly informative for those looking to study thermal expansion, phase change, and thermal creep in a thermomechanical model.