Presentazioni e Articoli Tecnici

In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.

The Full-System Approach for Elastohydrodynamic Lubrication

N. Fillot[1], T. Doki-Thonon[1], and W. Habchi[2]
[1]CNRS, INSA, Université de Lyon, Lyon, France
[2]Department of Industrial and Mechanical Engineering, Lebanese American University, Byblos, Lebanon

A ball is in contact with a plane, and a lubricant separates the two surfaces to decrease friction during their relative motion. To avoid wear, the lubricant film thickness should be higher than the surface roughness. The goal of this paper is to show how it is possible to solve efficiently the problem of elastohydrodynamics lubrication with COMSOL Multiphysics®, using a PDE (Partial ...

The Acoustoelastic Effect: EMAT Excitation and Reception of Lamb Waves in Pre-Stressed Metal Sheets

R.M.G. Ferrari[1]
[1]Danieli Automation S.p.A., Buttrio, UD, Italy

The acoustoelastic effect relates the change in the speed of an acoustic wave travelling in a solid, to the pre-stress of the propagation medium. In this work the possibility of assessing nondestructively the stress status in metal sheets, by using the acoustoelastic effect, is investigated. As the effect turns out to be very small for practical values of applied stress, the proposed technique ...

Simulation of Daisy Chain Flip-Chip Interconnections

G.S. Durante[1] and M. Fretz[1]

[1]CSEM Zentralschweiz, Alpnach Dorf, Switzerland

Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive adhesive (ACA) bonding, and AuSn20 eutectic solder. The single bumps were then measured with a high precision ...

3D Simulation of the Thermal Response Test in a U-tube Borehole Heat Exchanger

L. Schiavi[1]

[1]Dipartimento di Ingegneria Industriale, Università di Parma, Parma, Italy

Simulated Thermal Response Test (TRT) data are analyzed in order to evaluate the effect of the tridimensionality model’s feature in determining the proper value of the soil thermal conductivity and borehole thermal resistance. The 3D system’s simulation during the TRT is realized by adopting the finite element method. The comparison of the numerical results with the analytical ...

Dynamic Crack Propagation in Fiber Reinforced Composites

C. Caruso[1], P. Lonetti[1], and A. Manna[1]

[1]Department of Structural Engineering, University of Calabria, Arcavacata di Rende, CS, Italy

A generalized model to predict dynamic crack propagation in fiber composite structures is proposed. The proposed approach is based on a generalized formulation based on the Fracture Mechanics approach and Moving mesh methodology. Consistently to the Fracture Mechanics, the crack propagation depends from the energy release rate and its mode components, which are calculated by means of the ...

Inductance of Magnetic Plated Wires as a Function of Frequency and Plating Thickness

T. Graf[1], O. Schälli[1], A. Furrer[1], and P. Marty[1]

[1]Technik und Architektur, Hochschule Luzern, Horw, Switzerland

This paper analyzes the magnetic behavior of electroplated wires. For this purpose the resistance and inductance of single turn loops and coils have been simulated and measured. The measurement is delicate due to the influence of a stray capacitance. We show that the quality factor of magnetic plated loops and coils can be tuned easily by the plating thickness. In addition the quality factor of ...

Mathematical Modeling of Zig-Zag Traveling-Wave Electro-Osmotic Micropumps

J. Hrdlicka[1], P. Cervenka[1], M. Pribyl[1], and D. Snita[1]
[1]Department of Chemical Engineering, Institute of Chemical Technology Prague, Prague, Czech Republic

In this paper we present results of the mathematical modeling of AC electroosmotic micropumps. Unlike others we use the full dynamic description, instead of the linearized model. Skewed hybrid discretization meshes are employed in order to accurately capture the main features of the studied system. Also, we introduce zig-zag electrode arrangements for traveling-wave electroosmotic micropumps. The ...

An Acoustical Finite Element Model of Perforated Elements

P. Bonfiglio[1][2] and F. Pompoli[1][2]
[1]Materiacustica S.r.l., Ferrara, Italy
[2]Engineering Department, University of Ferrara, Ferrara, Italy

The present work deals with a numerical investigation of resonating systems used for noise control applications. In literature one can find analytical models based on fluiddynamics concepts for evaluating losses occurring across the holes of the perforates. In the paper an acoustical formulation based on the equivalent dissipative fluid approach will be analyzed. It will be firstly applied to ...

Classical Models of the Interface Between an Electrode and an Electrolyte

E. Gongadze[1], S. Petersen[1], U. Beck[2], and U. van Rienen[1]
[1]Institute of General Electrical Engineering, University of Rostock, Rostock, Germany
[2]Institute of Electronic Appliances and Circuits, University of Rostock,
Rostock, Germany

The Electrical Double Layer (EDL) plays a major role in understanding the interface between a charged surface (e.g. an implant) and ionic liquids (e.g. body fluids). The three classical models of the EDL (Helmholtz, Gouy, and Chapman-Stern) are numerically solved for a flat surface electrode in the 3D Electrostatics application mode of COMSOL Multiphysics® 3.5a. The values of the electric ...

Finite Element Analysis of Thermal Fatigue in Thermal Barrier Coatings

U. Bardi[1], C. Borri[1], A. Fossati[1], A. Lavacchi[1], and I. Perissi[1]
[1]Dipartimento di Chimica, Università degli Studi di Firenze, Sesto Fiorentino, FI, Italy

A Finite element model of plasma sprayed TBC’s was developed to estimate the stress induced by thermal cycling experiments. A heat transfer analysis was performed to evaluate the temperature distribution on the specimen during the cooling under an impinging air jet; temperature measurements performed with an infrared pyrometer on the cooled samples show good agreement with the evaluated ...

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