La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
These examples demonstrate how to generate randomized geometric surfaces. Note that there is now also an add-in covering random surface functionality for planar surfaces as well as a general purpose app: "Random Surface Generator". The COMSOL Multiphysics® software provides a ... Per saperne di più
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Per saperne di più
Using a Fluid-Solid Interaction multiphysics interface, the behavior of a spring-loaded ball check valve is studied under varying functional and reverse flow. The fluid force acting on the ball opens the valve at the opening pressure. In the case of a reversed pressure, the ball comes ... Per saperne di più
Liquid or gas acoustics coupled to structural objects such as membranes, plates or solids are important applications in many engineering fields. This model is a general demonstration of an acoustic fluid phenomenon in 3D that is coupled to a solid object. The walls of the solid object ... Per saperne di più
This model shows how to use the scattered field formulation to compute the transmission coefficient for impinging P and S plane elastic waves onto a finite size phononic crystal. The transmission tends to zero in the frequency range corresponding to P- and S-wave band gaps, as ... Per saperne di più
The thermal stress in a layered plate is studied in this example. A plate consisting of two layers, a coating and a substrate layer, is stress and strain free at 800 degrees C. The temperature of the plate is reduced to 150 degrees C and thermal stresses are induced due to the difference ... Per saperne di più
In his example, the lowest natural frequency of a 3D bracket are maximized using shape optimization. Per saperne di più
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... Per saperne di più
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Per saperne di più
This example demonstrates how to model coupled flow, heat transfer, and structural deformation and stress in a pipeline network. Gravity loads from the pipe and fluid are also taken into account. Per saperne di più
