La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Per saperne di più
This tutorial example is kindly provided by Dr. James Ransley at Veryst Engineering, LLC. This model continues from the base model “A Micromachined Comb-Drive Tuning Fork Rate Gyroscope”, which is also provided by Dr. Ransley. The model demonstrates how to accurately compute the effects ... Per saperne di più
FEM simulation can be used to obtain a SAW velocity and some related parameters (squared electromechanical coupling coefficient, reflectivity, etc.) for different typical configurations. Such parameters are input data for various analytical and semi-analytical methods of SAW device ... Per saperne di più
When designing a concert hall, it is extremely important to take the resonances into account. For a clear and neutral sound, the eigenfrequencies should be evenly spread through the registers. For the home stereo owner, who cannot actually change the shape of his living room, another ... Per saperne di più
This example studies viscoplastic creep in solder joints under thermal loading using the Anand viscoplasticity model, which is suitable for large, isotropic, viscoplastic deformations in combination with small elastic deformations. The geometry includes two electronic components (chips) ... Per saperne di più
This model shows how to model a simple Metal–Insulator–Metal (MIM) diode. The two metal electrodes are defined on each side using the Metal Contact feature. Two studies were performed: one without quantum tunneling across the potential barrier and the other including it, using the WKB ... Per saperne di più
This tutorial demonstrates how to build the geometry for the 3D biased resonator from GDS file using the ECAD Import Module and the Design Module. The procedure emulates semiconductor and MEMS fabrication processes to build 3D geometry more efficiently and is more intuitive for those ... Per saperne di più
This example models galvanic corrosion between two different phases in a magnesium alloy for a representative cross-sectional microstructure configuration. The Level Set interface is used here to model dissolution of a constituent phase leading to topological changes. The electrode ... Per saperne di più
