La Galleria delle Applicazioni raccoglie un'ampia varietà di modelli tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.

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Argon Boltzmann Analysis

The electron energy distribution function (EEDF) plays an important role in the overall behavior of discharges. Analytic forms of the EEDF exist such as Maxwellian or Druyvesteyn, but in some cases they fail to fit the discharge physics. This tutorial model investigates the effects of various parameters on the electron energy distribution function and rate coefficients for an argon discharge.

Simulation of Shock Absorber in Landing Gear

This model simulates the dynamics of the shock absorber used in a landing gear mechanism of an aircraft. It analyses the stresses, as well as the heat generated in the landing gear components due to the energy dissipated in the shock absorber. A prismatic joint, with spring and damper, is used to model the shock absorber assembly.

Crevice Corrosion of Iron in an Acetic Acid/Sodium Acetate Solution

Mass transport limitations within thin crevices can often result in the local electrochemistry to differ significantly between the crevice opening (mouth) and end (tip), and as a result of the differences in local chemistry, corrosion may occur. This example models crevice corrosion of iron in an acetic acid/sodium acetate solution. The model reproduces the results of Walton.

Rolling of a Rigid Wheel

The purpose of this model is to demonstrate pure rolling of a rigid wheel when given initial forward velocity together with lean about the forward direction. This is implemented through the Multibody dynamics module in COMSOL Multiphysics. The rolling motion of the wheel has been implemented without the use of contact.

Generalized Kelvin Viscoelastic Material

The behavior of viscoelastic materials can be represented by conceptual models composed of elastic and viscous elements connected in series or in parallel. The rheology of the generalized Kelvin model (also called generalized Kelvin-Voigt model) consists of an elastic spring to represent the instantaneous stiffness plus n Kelvin-Voigt branches connected in series. This example shows how to ...

Fatigue Failure of an Eyeglass Frame

In the search for weight reduction, the cross-section of an eyeglass frame is continuously reduced. The thin section over the nose transfers the entire load between the two halves. This example predicts the fatigue life using the combined Basquin and Coffin-Manson model when eyeglasses are subjected to bending.

Electrodeposition of a Microconnector Bump in 2D

This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal displays (LCDs) and driver chips. The location of the bumps on the electrode surface is controlled by the use ...

Slip Flow Benchmark

This model is a benchmark model for the Slip Flow interface. It is based on both analytic and numeric calculations. Air at atmospheric pressure flows through a conducting micro-channel connecting two reservoirs maintained at different temperatures. A flow between the two reservoirs develops as a result of thermal creep along the channel wall, which in turn produces a pressure gradient. At steady ...

Kirsch Infinite Plate Problem

This model describes a static stress analysis to obtain the stress distribution in the vicinity of a small hole in an infinite plate. The model is a classic benchmark and is described in Mechanics of Material, by D. Roylance. The stress level is then compared with the theoretical values.

Electrodeposition on a Resistive Patterned Wafer

This example models time-dependent copper deposition on a resistive wafer in a cupplater reactor. As the deposited layer builds up, the resistive losses of the deposited layer decreases. The benefit of using a current thief for a more uniform deposit is demonstrated.