La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Per saperne di più
In every system where there is conduction of electric current, and where the conductivity of the material is finite, there will be electric heating. Electric heating, also referred to as Joule heating, is in many cases an undesired by-product of current conduction. This model simulates a ... Per saperne di più
This model simulates the shape evolution of a microconnector bump over time as copper deposits on an electrode surface. Transport of cupric ions in the electrolyte occurs by convection and diffusion. The electrode kinetics are described by a concentration dependent Butler-Volmer ... Per saperne di più
Fiber composites are widely used in industrial applications. Compared to more traditional metallic engineering materials, fiber composites often have superior specific stiffness and strength properties, and they are often more corrosion resistant. Also, properties like strength, ... Per saperne di più
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... Per saperne di più
Many engineering structures consist of thin and slender components, where a full solid model will result in extremely many small elements. For such structures, it is much more efficient to use shell or beam elements. In this tutorial and verification model, it is shown how to connect ... Per saperne di più
In this model, we introduce a cloaking method using an electrically tuned monolayer of graphene. We will show that when a cylindrical dielectric scatterer is covered in graphene, the scattering cross section is greatly reduced at the designated frequency, making it electromagnetically ... Per saperne di più
Magnetic resonance imaging (MRI) systems generate a magnetic flux density (B-field) to create images. Providing a homogeneous field distribution within a birdcage coil is a key factor for improving the quality of the scanned data. A homogeneous magnetic field can be found through ... Per saperne di più
This tutorial utilizes the Particle Beam feature to examine the performance of a high-precision spectrometer. An ion beam is subjected to electric and magnetic forces, and only a fraction of the incoming beam is transmitted to the detector. The Particle Counter feature is used to compute ... Per saperne di più
Shape optimization with respect to fatigue properties is not supported, but fatigue properties are well correlated with the maximum stress. The model demonstrates how optimization with respect to a p-norm of the von Mises stress can be used to improve fatigue properties without ... Per saperne di più