La Galleria delle Applicazioni raccoglie un'ampia varietà di modelli tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.

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Heat Transfer by Free Convection

This example describes an array of heating tubes submerged in a vessel with fluid flow entering at the bottom. This is a multiphysics model because it involves fluid dynamics coupled with heat transfer. The pressure and the velocity field are the solution of the Navier-Stokes equations, while the temperature is solved through the heat equation. In this model, the equations are coupled in both ...

Turbulent Flow Over a Backward Facing Step

The backward facing step is an interesting case for studying the performance and solution strategy of a turbulence model. In this case, the flow is subjected to a sudden increase of cross-sectional area, resulting in a separation of flow starting at the point of expansion. Spatial variations in the velocity field cause production of turbulence outside the wall region and its interaction with ...

Effective Diffusivity in Porous Materials

Transport through porous structures is usually treated using simplified homogeneous models with effective transport properties. This is in most cases a necessity, since the typical dimensions of the pores and particles making up the porous structure are several orders of magnitude smaller than the size of the domain that is to be modeled. This model introduces the concept of effective ...

Small Signal Analysis of a MOSFET

This model shows how to compute the AC characteristics of a MOSFET. Both the output conductance and the transconductance are computed as a function of the drain current.

Fluid-Structure Interaction

This model demonstrates how to set up a fluid-structure interaction problem in COMSOL Multiphysics. It illustrates how fluid flow can deform solid structures and how to solve for the flow in a continuously deforming geometry. The Fluid-Structure Interaction (FSI) multiphysics interface combines fluid flow with solid mechanics to capture the interaction between the fluid and the solid structure. ...

Distributed Bragg Reflector

A distributed Bragg reflector (DBR) is a periodic structure formed from alternating dielectric layers that can be used to achieve nearly total reflection within a range of frequencies. In this model a Bragg reflector is modeled with a central wavelength of 550[nm] and stopband of 180[nm].

Sonic Crystal

Phononic and sonic crystals have generated rising scientific interest for very diverse technological applications. These crystals are made of periodic distributions of scatterers embedded in a matrix. Under certain conditions, acoustic band gaps can form. These are spectral bands where propagation of waves is forbidden. This model first analyzes as sonic crystal and determines its band ...

Electrical Signals in a Heart

Modeling the electrical activity in cardiac tissue is an important step in understanding the patterns of contractions and dilations in the heart. The heart produces rhythmic electrical pulses, which trigger the mechanical contractions of the muscle. A number of heart conditions involve an elevated risk of re-entry of the signals. This means that the normal steady pulse is disturbed, a severe and ...

Free Convection in a Water Glass

This model treats the free convection and heat transfer of a glass of cold water heated to room temperature. Initially, the glass and the water are at 5 °C and are then put on a table in a room at 25 °C. The nonisothermal flow is coupled to heat transfer using the Heat Transfer module.

Energy-Based Thermal Fatigue Prediction in a Ball Grid Array

In a cooling system, a microelectronic component has been identified as the critical link. Since the power is repeatedly switched on and off, the component is subjected to thermal cycling. As a results a crack grows through a solder joint and disconnects the chip from the printed circuit board so that the component loses its operational functionality. The lifetime of the solder joints in two ...