La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
During quenching of steel, austenite decomposes into phases such as ferrite, pearlite, bainite, and martensite. A common way to illustrate the phase transformation characteristics of a particular steel alloy is to use transformation diagrams. Two of the most commonly used diagram types ... Per saperne di più
In nature, geckos use dry adhesion forces to climb walls. They have inspired researchers to develop synthetic gecko foot hairs to be used in, for example, robot applications. This model contains the nano/micro hierarchy of a synthetic gecko foot hair, where cantilever beams both in nano ... Per saperne di più
This application uses the Chemical Reaction Engineering Module to study an elementary, exothermic, irreversible reaction in a tubular reactor (liquid phase, laminar flow regime). To keep its temperature down, the reactor uses a cooling jacket with a constant coolant temperature. The ... Per saperne di più
This benchmark model compares the damping coefficients of perforated plates from computation results versus experimental data. The simulation includes 18 different geometric configurations. It uses the Bao's perforation model, which is built-in in the Thin Film Flow physics interface. ... Per saperne di più
This model shows how to compute the AC characteristics of a MOSFET. Both the output conductance and the transconductance are computed as a function of the drain current. Per saperne di più
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Per saperne di più
This tutorial model shows the setup of a 2D axisymmetric stress analysis, through contact, of a 3D threaded pipe fitting. The example involves synchronizing the 3D PTC Creo Parametric™ geometry and selections, which specify the faces in contact, with the 2D geometry in COMSOL ... Per saperne di più
This tutorial demonstrates how to compute the periodic steady-state solution of a nonlinear model problem using an optimization solver. The solver modifies the initial conditions at the beginning of a period to match the solution at the end of the period. The model solves much faster ... Per saperne di più
The underlying physics of a capacitively coupled plasma is rather complicated, even for rather simple geometric configurations and plasma chemistries. This model benchmarks the Capacitively Coupled Plasma physics interface against many different codes. Per saperne di più
The contact impedance boundary condition is meant to approximate a thin layer of material that impedes the flow of current normal to the boundary, but does not introduce any additional conduction path tangential to the boundary. This example compares the contact impedance boundary ... Per saperne di più