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Friction Stir Welding of an Aluminum Plate

In friction stir welding, a rotating tool moves along the weld joint and melts the aluminum through the generation of friction heat. The tool’s rotation stirs the melted aluminum such that the two plates are joined. In this model, two aluminum plates are joined by generating friction heat with a rotating tool. Heat is transferred by conduction from the tool into the plates. The movement of ...

Convection Cooking of Chicken Patties

When cooking food, such as a patty, in convection ovens there is a trade off in the heating method. If the patty is heated at a low oven temperature the cooking is slow and the patty dries out, resulting in a poor taste. If the patty is heated rapidly at a high temperature, it is difficult to get an even temperature in the patty. When the core is cooked the crust may be over-cooked. This ...

Thermo-Mechanical Analysis of a Surface-Mounted Resistor

The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components producing heat it is a well-known problem that temperature cycling can lead to cracks propagating through the ...

Out-of-Plane Heat Transfer for a Thin Plate

This example models heat transfer in a thin rectangular metal plate. Because the plate’s thickness is only 1/100 of its length and width, you can simulate the process using a 2D approximation. The plate has a fixed temperature at one end and is isolated at the other. A surrounding liquid cools the plate by convection. In addition, the model considers surface-to-ambient radiation.

Thermal Modeling of a Microchannel Heat Sink

Thermal management has become a critical aspect of today’s electronic systems, which often include many high-performance circuits that dissipate large amounts of heat. Many of these components require efficient cooling to prevent overheating. Some of these components, such as processors, require a heat sink with cooling fins that are exposed to forced air from a fan. This discussion develops the ...

Disk-Stack Heat Sink

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such ...

Non-Isothermal MEMS Heat Exchanger

The example concerns a stainless-steel MEMS heat exchanger, which you can find in lab-on-a-chip devices in biotechnology and in microreactors such as for micro fuel cells. This model examines the heat exchanger in 3D, and it involves heat transfer through both convection and conduction. The model solves for the temperature and heat flux in the device and investigate the convective term’s ...

Silica Glass Block Coated with a Copper Layer

In this time-dependent model, a silica block of glass, coated with a thin copper layer is subjected to a heat flux. Copper is a highly conductive material, while the silica glass is of poor thermal conductivity, which sets up an highly-varied temperature differential. The model must therefore account for a highly conductive layer. This is done, using a the Highly Conductive Layer feature in ...

Thermoelectric Leg

A thermoelectric leg is a fundamental component of a thermoelectric cooler (or heater). For example, a thermocouple is a thermoelectric module typically made of two thermoelectric legs: one made of p-type and of one n-type semiconductor material which are connected in series electrically and in parallel thermally.

Rapid Thermal Annealing

In the semiconductor industry, rapid thermal annealing (RTA) is a semiconductor process step used for the activation of dopants and the interfacial reaction of metal contacts. In principle, the operation involves rapid heating of a wafer from ambient to approximately 1000–1500 K. As soon as the wafer reaches this temperature, it is held there for a few seconds and then finally quenched. An ...