La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
Drying of porous media is an important process in the food and paper industry among others. Many physical effects must be considered: fluid flow, heat transfer with phase change, and transport of participating liquids and gases. All of these effects are strongly coupled, and predefined ... Per saperne di più
This tutorial shows how to couple three physics interfaces to model evaporative cooling. The effects that need to be taken into account are heat transfer, transport of water vapor, and fluid flow. The Wet Surface feature is used to implement the source term for the water vapor and to ... Per saperne di più
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... Per saperne di più
Double-pipe heat exchangers, with their typical U-turn shape, are one of the simplest and cheapest type of heat exchangers used in the chemical process industry. This example studies the cooling of hot oil (130°C) by a cool oil (60°C) entering in counter-current. As the oils flow ... Per saperne di più
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... Per saperne di più
This example demonstrates how to model phase transition by a moving boundary interface according to the Stefan problem. A square cavity containing both solid and liquid tin is submitted to a temperature difference between left and right boundaries. Fluid and solid parts are solved in ... Per saperne di più
This example models the casting process of a metal rod from liquid to solid state using the Non-Isothermal Flow multiphysics interface, which combines heat transfer and fluid flow. The model describes the fluid and solid flow and heat transport, including the phase transfer from melt to ... Per saperne di più
This model demonstrates the use of the Heat and Moisture Flow features for the simulation of superheated steam drying of a wood particle. A nonequilibrium formulation is used to compute the transport of the liquid water and vapor phases in the wood particle. Reference: Le, K. H., ... Per saperne di più
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Thin Layer boundary condition with the thermally thick option is used to avoid ... Per saperne di più
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Per saperne di più
