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Thin-Film Resistance

Application ID: 31


In modeling of transport by diffusion or conduction in thin layers, we often encounter large differences in dimensions of the different domains in a model.

If the modeled structure is a so-called sandwich structure, we can replace the thinnest geometrical layers with a thin layer approximation, provided that the difference in thickness is very large.

This method can be used in many diffusive problems, such as heat and current conduction as well as molecular diffusion. In this model, this technique is used to model a conductive media problem, where a thin film is located between two plates. The thin film approximation model is then compared with the full 3D model.

Questo modello è stato realizzato con:

COMSOL Multiphysics®

The combination of COMSOL® products required to model your application depends on the physics interfaces that define it. Particular physics interfaces may be common to several products (see the Specification Chart for more details). To determine the right combination of products for your project, you should evaluate all of your needs in light of each product's capabilities, consultation with the COMSOL Sales and Support teams, and the use of an evaluation license.