Disk-Stack Heat Sink

Application ID: 3576

This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to even out the temperature distribution. This exercise highlights a number of useful modeling techniques such as combining 3D solids and shells and using thin layer boundary conditions in replacing 3D thin geometries by 2D boundaries.

This model example illustrates applications of this type that would nominally be built using the following products:

Heat Transfer Module