BE CAE & Test Builds a Surface-Mount Device App for Thermal Analysis
Giuseppe Petrone, BE CAE & Test, Italy
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
Suggested Stories
Generative Design Puts Hydrogen Fuel Cell Development in High Gear
Toyota Research Institute of North America (TRINA) is working on hydrogen-powered vehicles. The TRINA team is using ...
Better Ways to Heat and Cool Buildings
Adsorptive climate control systems can reduce the power required to heat and cool buildings by running primarily on ...
Lightweighting with Aluminum: Corrosion Apps Guide Leading Design
To achieve fuel efficiency goals, conventional materials for car structures, such as structural steel, must be ...
Lighting the Way for Improved Synchrotron Vacuum Chambers at RadiaSoft
One of the goals of the Argonne National Laboratory (ANL) is to increase the brightness of synchrotron beams for the ...
