BE CAE & Test Builds a Surface-Mount Device App for Thermal Analysis
Giuseppe Petrone, BE CAE & Test, Italy
BE CAE & Test, a COMSOL Certified Consultant, created a thermal model of a surface-mount device for a client and converted it into a simulation app with the Application Builder in COMSOL Multiphysics®, providing an interactive deliverable that could be used to investigate the system. Their clients are pleased to use an interactive tool with which they can investigate their system.
In the simulation app, the end user can vary the material of the solder layer and silicon die, thickness of the solder layer, and dissipated thermal power to examine the impact on maximum junction temperatures and junction-to-case thermal resistance.
Suggested Stories
Optimizing Ultrasound Piezo-disk Transducers
Esaote S.p.A. produces medical diagnostic systems, including the manufacturing and sales of ultrasound imaging ...
Fine Tuning for Water Purification
Amsterdam Water Supply (AWS) of the Netherlands produces some of the cleanest drinking water in the world using an ...
MRI Tumor-Tracked Cancer Treatment
Radiation therapy targeting in cancer treatment involves many uncertainties, including the movement of targeted sites ...
When it’s Impossible to Take Actual Measurements, Multiphysics Provides the Answers
To contain splashes and provide protection at plants where metal is fabricated, blast furnace runners need a roof made ...
