Nokia Uses Simulation to Analyze an Oscillating Piezoelectric Fan Blade
Akshat Agarwal, Nokia Bell Labs, Ireland
As electronics grow smaller and smaller and are used for extensive periods of time, their internal heat loads are greater and demand new compact cooling methods. Piezoelectric fans, a stepping stone between natural and forced convection, are one attractive option due to their low energy requirements. Engineers at Nokia Bell Labs are using multiphysics simulation to capture the interplay between an oscillating piezoelectric fan and the surrounding airflow in the pursuit of a quiet, reliable, and low-energy cooling solution.
Suggested Stories
Training Uncrewed Underwater Vehicles for Visualization of Subsurface Structures
By using simulation apps and machine learning techniques, USM researchers are laying the groundwork for UUVs capable ...
Lightweighting with Aluminum: Corrosion Apps Guide Leading Design
To achieve fuel efficiency goals, conventional materials for car structures, such as structural steel, must be ...
Virtual Material Design in 3D Printing Makes Headway with Multiscale Modeling
The advantages of anisotropic properties in 3D printing materials have been difficult to exploit for product design, ...
Optimizing Heat Exchanger Designs for Refrigeration and Cooling Technology
thermofin GmbH, a leading manufacturer of heat exchangers, ensures that their devices are optimized for a variety of ...
