Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.
Visualizza gli articoli presentati alla COMSOL Conference 2020
This paper presents the design and simulation of micromixer for Lab-On-Chip (LOC) applications. There are two types of micromixers: one is an active micromixer and another one is a passive micromixer. This paper investigates microfluidic flow characterization and mixing rate of two ... Per saperne di più
For the SAFARI Imaging Spectrometer, part of the SPICA satellite payload, a Calibration Source is under development. Challenges in the design include the low cooling power (few mW) available at cryogenic temperatures. COMSOL Multiphysics® simulations were used extensively in the design ... Per saperne di più
The Thomson coil’s (TC) inherent characteristics are appropriate to meet the needs of high speed actuators for mechanical switching devices in so-called smart grids. This is due to the massive forces that it can exert in the time scale of milliseconds. A coupled COMSOL Multiphysics model ... Per saperne di più
Introduction: Medium voltage reclosers are representing nowadays an important link between transmission power systems and low voltage grids. With a high level of renewable energy penetration, the medium voltage networks are becoming bidirectional. Therefore, the associated switching ... Per saperne di più
The accurate estimate of values of electromagnetic parameters are essential to determine the final circuit speeds and functionality for designing of high-performance integrated circuits and integrated circuits packaging. In this paper, the quasi-TEM analyses of symmetrical triple coupled ... Per saperne di più
A model utilizing interdimensional variable coupling is presented for simulating the thermal hydraulic interactions of the High Flux Isotope Reactor (HFIR) core at Oak Ridge National Laboratory (ORNL). The model’s domain consists of a three-dimensional fuel plate and a two-dimensional ... Per saperne di più
Subduction processes have great importance as are related to volcanism and earthquake occurrence. Old and cold plates should subduct steeper than younger ones, but the subduction angle is highly variable and does not always correlate with the age of the plates. Some researchers propose a ... Per saperne di più
In this work the influence of the geometry of the Vickers indenter tip on relevant indentation properties is investigated during instrumented indentation operated in the macro range (i.e. with forces ranging from 2 to 200 N) and carried out in the case of a homogenized (i.e. heat ... Per saperne di più
The microstrip line is widely used as the planar transmission line in microwave integrated circuits and high speed interconnecting buses. In this paper, we use COMSOL Multiphysics® to study multiconductor microstrip systems on microwave integrated circuits. We specifically illustrate ... Per saperne di più
Research at Fraunhofer EMI addresses the response of materials in extreme dynamic loads. Besides mechanical or thermal loads, intense electric pulse currents also represent an extreme dynamic load. Experimentally, metallic samples, mainly thick wires, were electro-mechanically loaded ... Per saperne di più