Scopri come la simulazione multifisica viene utilizzata in tutto il mondo per ricerca e sviluppo
La modellazione e simulazione multifisica favorisce l’innovazione in numerosi settori industriali e nel mondo accademico, come dimostrano le molteplici applicazioni illustrate negli articoli tecnici e nei poster presentati ogni anno da ingegneri, ricercatori e scienziati alla COMSOL Conference.
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Visualizza gli articoli presentati alla COMSOL Conference 2026
The development of microfluidic components for implementation of a lab-on-chip system requires both fluid movements under a controlled environment as well as sensitive detection. This work involves the design and simulation of micro-reactors with integrated heating as well as optical ... Per saperne di più
The aim of this work is to investigate the impact of the structural parameter on the signal of the impedance based microfluidic flow cytometer for cell detection. A well-established optical technique for counting, identifying and sorting cells is flow cyto-fluorimetry, which is an ... Per saperne di più
Rebar detectors are used extensively by construction contractors to locate rebars while drilling, coring or cutting in RCC to avoid causing damage to the reinforcement steel. These detectors are also used by inspection engineers for spot checking of civil infrastructure. Most cost ... Per saperne di più
Manufacturing of an apparatus for experimental purpose pose certain difficulties due to the process involved. For a 20L perfect sphere, manufacturing by forging or any other process is not economical, due to which the equipment is manufactured with modified dimensions. This paper aims to ... Per saperne di più
Undesirable shocks and vibrations are a noteworthy issue in numerous human exercises and domains. Therefore, various damping techniques are used to minimise vibrations, can be classified as active, Semi-active and passive damping. The development of semi-actively controlled ... Per saperne di più
Introduction In this work, we will present an equation based technique for MOSFET simulation in COMSOL 5.4 and will discuss about the challenges faced in doing the same. The idea behind such a methodology is to demonstrate the coupling of the existing semiconductor equations with ... Per saperne di più
Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... Per saperne di più
Fiber Reinforced Polymer (FRP) laminated composites have extensive application in the field of aerospace, marine, sports, bio-medical and lot more. FRP is mostly utilised for its high strength to weight ratio. Since, its failure is catastrophic in nature. There is need to study its ... Per saperne di più
