Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
La modellazione e simulazione multifisica favorisce l’innovazione in numerosi settori industriali e nel mondo accademico, come dimostrano le molteplici applicazioni illustrate negli articoli tecnici e nei poster presentati ogni anno da ingegneri, ricercatori e scienziati alla COMSOL Conference.
Lasciati ispirare dai recenti contributi raccolti qui sotto oppure, per trovare una presentazione specifica o filtrare i risultati per area di applicazione, anno o sede della conferenza, utilizza lo strumento di Ricerca Rapida.
Visualizza gli articoli presentati alla COMSOL Conference 2025
Outline of presentation: theory of phase-field modeling of ferroelectric materials parameter identification in free energy density finite element implementation: PDE form weak form periodic boundary conditions: electrical mechanical domain configurations intrinsic and extrinsic ... Per saperne di più
Svante Littmarck is the CEO of the COMSOL group. He co-founded COMSOL in 1986. He holds a M.Sc. in Applied Mathematics from the Royal Institute of Technology in Stockholm. In 2004 he received an honorary doctoral degree from the Royal Institute of Technology. Per saperne di più
The oxidation behavior of metallic nanoparticles is investigated in respect to material parameters like Mott potential, defects on the microstructure and oxide volume increase per ionic defect. An emphasis is laid on magnetic nanoparticles where the degree of oxidation can be measured ... Per saperne di più
Flip-chip interconnection technologies have been tested through the use of a test chip with embedded single-bump daisy chains. The Flip-Chip technologies are selected among Au bump Thermocompression (TC) with and without Nonconductive Adhesives (NCA) underfiller, anisotropic conductive ... Per saperne di più
Capacitor Discharge Sintering (CDS) is an ultrafast Electric Current Assisted Sintering method (u-ECAS) suited for electrically conductive powders. It is characterized by relatively short processing times (milliseconds range) and much lower sintering temperatures than the melting point ... Per saperne di più
The excessive presence of residual SiC matrix inter-fiber pores is often the main cause for the very poor mechanical strength and toughness of SiC/SiC composites manufactured by CVI (Chemical Vapour Infiltration) process. This work presents a micro/macro Microwaveassisted Chemical Vapour ... Per saperne di più
In this poster, a numerical model of spot pulsed current TIG welding for partially and fully penetrated weld pools is presented. Heat transfer and fluid flow in the weld pool driven by the combination of electromagnetic force, buoyancy force, surface tension gradient and latent heat are ... Per saperne di più
Corona discharge is used in several applications such as surface treatment of polymers, photocopying or dust removal in air conditioning. Streamer formation is undesirable for most of these applications. Therefore, several studies have been dedicated to investigate the formation and ... Per saperne di più
In general, there is a wide range of applications requiring coupled electromagneticstructural analysis. In this paper, two of such coupled problems have been analyzed. The first one is a transient analysis of Electromagnetic Forming process and the other problem is a deformation analysis ... Per saperne di più
Surfaces with water contact angle greater than 150º are super-hydrophobic in nature and possess extraordinary water repelling properties. Various researches on wettability of textured surfaces in recent years have shown that texturing surfaces with micron-sized and nanosized patterns ... Per saperne di più
