In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.

Design of Novel Recirculation System for Slow Reacting Assays in Microfluidic Domain

N.N. Sharma, and A. Tekawade
Mechanical Engineering Group, Birla Institute of Technology & Science, Pilani, Rajasthan, India

A simple design for a microfluidic flow system for use in mixing or reacting assays with limited sample availability has been proposed and analyzed using COMSOL\'s multiphysics simulation package. The design is based on differential electroosmotic flow concept which has facilitated a number of interesting flow phenomena in micro-domains. For an average potential drop of about 86 kV/m in the ...

A Methodology For The Simulation Of MEMS Spiral Inductances Used As Magnetic Sensors

S. Druart, D. Flandre, and L.A. Francis
Université catholique de Louvain - ICTEAM, Louvain-la-Neuve, Belgium

In this paper, a methodology to simulate the electric behavior of spiral inductances is presented and discussed. All the methodology is built with the COMSOL software used with the Matlab scripting interface and then allows performing fully parameterized simulations. The program architecture is explained and is used to simulate two applications. The first calculates the voltage induced by an ...

Multi-Domain Analysis of Silicon Structures for MEMS Based-Sensors

N. Bhalla[1], S. Li[2], and D. Chung[1]
[1]Chung Yuan Christian University, Chungli,Taiwan
[2]National Tsing Hua University, Hsinchu, Taiwan

Investigation in this paper aims at performing Mechanical Stress Strain analysis, Thermal, Piezoresistive and Piezoeletric analysis of Silicon Structures using COMSOL. The simulation results have been cross checked by mathematical calculation.

Design and Characterization of a MEMS Varactor

V. S. Nagaraja, N. Suma, and S. L. Pinjare
Nitte Meenakshi Institute of Technology

The tunable capacitor (variable capacitor) is one of the most important and components in filters, Phase shifters, VCO etc. A tunable capacitor can also be built using electro – thermal actuating mechanism. Compared to electro static, tunable capacitors actuated by thermal actuators have several advantages like lower driving voltages. The performance of thermal actuator becomes a key factor ...

Xylophone Bar Magnetometry and Inertial-grade MEMS Optimisation: a Multiphysics Approach

H. T. D. Grigg, and B. J. Gallacher
Microsystems Group
Newcastle University
Newcastle upon Tyne
Tyne and Wear, UK

This paper presents ongoing research aimed at development of a MEMS magnetometer capable of nanoTesla sensitivity. Such a device would pave the way for inertial-grade MEMS IMUs. A resonant sensor is proposed, based on a Xylophone Bar sense element, and is analysed both directly and via COMSOL. Mode shapes and frequencies are found as functions of geometric parameters, and the results used ...

Optical Manipulation of Microscopic Objects

R. Ozawa
Yokohama University

In recent years, optical manipulation using optical radiation pressure has been widely studied. In this study, the radiation pressure exerted on various kinds of microscopic objects with different laser beams was evaluated by COMSOL Multiphysics software. By changing beam shapes, microscopic objects can be trapped and rotated. This paper is in Japanese.

µHeater on a Buckled Cantilever Plate for Gas Sensor Applications

A. Arpys Arevalo Carreno[1], E. Byas[1], I.G. Foulds[1]
[1]King Abdullah University of Science and Technology, Thuwal, Mecca, Kingdom of Saudi Arabia

In semiconductor gas sensors, the base of the gas detection is the interaction of the gaseous species at the surface of the semiconducting sensitive material. Since the chemical reactions at the surface of the sensor material are functions of temperature. We simulate our µHeater design on a Buckled Cantilever Plate (BCP). Such structure allows the sensor to be suspended for thermal insulation. ...

Mechanical Model of RF MEMS Capacitor Structures

R. Chatim[1]
[1]University of Kassel, Kassel, Germany

In order to design an RF MEMS based device, it is beneficial to have information concerning mechanical behavior. For model verification purpose, solution offered by simulation software equipped with predefined physics application is one valuable way to provide initial reference. To avoid unwanted particular total strain in RF MEMS structures, a compensation layer can be utilized. When the number ...

Heat-Sink Solution through Artificial Nanodielectrics for LED Lighting Application

N. Badi[1], R. Mekala[2]
[1]Department of Physics, Center for Advanced Materials, University of Houston, Houston, TX, USA
[2]Department of Electrical & Computer Engineering, University of Houston, Houston, TX, USA

Thermally conducting but electrically insulating materials are needed for heat-sink LED lighting applications. We report on a cost effective and innovative method based on creating core-shell nanoparticles in polymer with aluminum (Al) nanoparticles as the high thermal conductivity core and ultrathin aluminum oxide (Al?O?) as a capping shell. The solid oxide shell around the Al core prevents ...

FEM-Simulation of a Printed Acceleration Sensor with RF Readout Circuit

H. Schweiger[1], T. Göstenkors[1], R. Bau[1], D. Zielke[1]
[1]Dept. Engineering Sciences and Mathematics, University of Applied Sciences Bielefeld, Bielefeld, Germany

In this paper we want to figure out the development of a capacitive acceleration-sensor system with the FEM-Method. The sensor-system is in the position to detect accelerations in the range of ±20 g. Furthermore the sensor-element contains a printed RF-inductance, which is used for contactless data transfer. On the one hand the simulation of the L-C-oscillating circuit using the RF Module of ...