COMSOL Conference 2026 Proceedings
Collection of Papers, Posters, and Slideshows Accepted by the Program Committee
Alla COMSOL Conference 2026, ingegneri, ricercatori e scienziati di tutto il mondo hanno presentato il loro lavoro di simulazione, con applicazioni in tutti i principali settori industriali e nel mondo accademico. Utilizza lo strumento di ricerca rapida per trovare una presentazione specifica oppure filtra i contenuti per argomento o sede dell’evento.
The development of microfluidic components for implementation of a lab-on-chip system requires both fluid movements under a controlled environment as well as sensitive detection. This work involves the design and simulation of micro-reactors with integrated heating as well as optical ... Per saperne di più
Manufacturing of an apparatus for experimental purpose pose certain difficulties due to the process involved. For a 20L perfect sphere, manufacturing by forging or any other process is not economical, due to which the equipment is manufactured with modified dimensions. This paper aims to ... Per saperne di più
Modelling 3D IC structures with Through Silicon Vias (TSVs) and micro bumps is a promising technique to achieve “more than Moore” integration. Conventionally, Copper (Cu) is used as a TSV material. However, due to rapid scaling of interconnect, problems like electro-migration and surface ... Per saperne di più
An accelerometer detects acceleration and tilt of a device. There are several areas where accelerometers are in use, e.g. aerospace, navigation, automotive industry, electronic gadgets etc. According to different working principle, there are different types of accelerometer, e.g. piezo ... Per saperne di più
In this, FEM simulation of the interdigitated electrodes (IDEs) device using COMSOL Multiphysics® is presented. In this study, the effect of meshing sequence on the performance of IDEs device was evaluated using normal as well as adaptive mesh refinement. The key parameters such as of ... Per saperne di più
Surface Acoustic Wave devices are classic examples of Micro Electro Mechanical Systems (MEMS). These devices basically utilize inter-digitated electrodes (IDE) and a piezoelectric layer deposited over a substrate. The input IDT is supplied with alternating voltage and because of this, ... Per saperne di più
This paper discusses coaxial carbon nano structure for THz range interconnect. Rolled Graphene is typically a carbon nano tube (CNT) designed by using hexagonal Boron Nitride as dielectric and Graphene layer on outer side of CNT. The paper analysis the interconnect bandwidth by measuring ... Per saperne di più
The paper focuses on study of the affect of different parameters on the response of a Proof mass of a capacitive accelerometer. The proof mass is modeled for different structures while keeping the parameters values constant. The structural construction and the geometric parameters like ... Per saperne di più
