Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
La modellazione e simulazione multifisica favorisce l’innovazione in numerosi settori industriali e nel mondo accademico, come dimostrano le molteplici applicazioni illustrate negli articoli tecnici e nei poster presentati ogni anno da ingegneri, ricercatori e scienziati alla COMSOL Conference.
Lasciati ispirare dai recenti contributi raccolti qui sotto oppure, per trovare una presentazione specifica o filtrare i risultati per area di applicazione, anno o sede della conferenza, utilizza lo strumento di Ricerca Rapida.
Visualizza gli articoli presentati alla COMSOL Conference 2025
Wire Electric Discharge Machining (WEDM) is widely used technique for machining intricate geometries. It is a spark erosion, non contact machining process and this gives it an advantage in machining metals irrespective of their hardness [1]. Main process parameters of WEDM are peak ... Per saperne di più
Active Infrared Thermography (IRT) is a family of non-destructive testing (NDT) techniques used for the detection of surface and buried defects in a wide range of materials. The method is robust and sensitive enough to be used even in harsh industrial environments However, the ... Per saperne di più
A technological revolution of Point-Of-Care (POC) devices is becoming essential, especially infectious diseases diagnosis for vulnerable population, it can be achieved by upgrading the Lab on Card device. In this device, the reaction is conducted by an Eppendorf tube as a biological ... Per saperne di più
Development of micro-pumps will allow the minimization of many mechanical, bio-engineered and electrical systems, for example: controlled drug delivery systems or liquid cooled microprocessors. The development of such system is facing two major challenges: the design of actuation ... Per saperne di più
This paper assesses the capability and sensitivity of COMSOL Multiphysics® to evaluate phase-changing material suitability for Thermal Energy Storage. The simulated system is a packed bed of encapsulated spheres, containing phase changing materials (PCM), placed inside a single ... Per saperne di più
This abstract describes a COMSOL® App that has been created to perform thermal simulations of an electronics assembly. The assembly comprises fourteen components including a photonic integrated circuit (PIC), a printed circuit board assembly (PCBA), a thermoelectric cooling (TEC) Peltier ... Per saperne di più
Environmental factors such as temperature and humidity can significantly affect the quality of the metal powder used in power bed fusion additive manufacturing, leading to variations in the integrity of finished components. It is therefore important to monitor and minimize the exposure ... Per saperne di più
Additive manufacturing processes are increasingly used for designing metallic parts with complex geometries. The current needs are focused on the manufacturing of large-scale parts, typically of meter range. However, for such dimensions, the traditional trial-and-error methodology used ... Per saperne di più
