Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo
La modellazione e simulazione multifisica favorisce l’innovazione in numerosi settori industriali e nel mondo accademico, come dimostrano le molteplici applicazioni illustrate negli articoli tecnici e nei poster presentati ogni anno da ingegneri, ricercatori e scienziati alla COMSOL Conference.
Lasciati ispirare dai recenti contributi raccolti qui sotto oppure, per trovare una presentazione specifica o filtrare i risultati per area di applicazione, anno o sede della conferenza, utilizza lo strumento di Ricerca Rapida.
Visualizza gli articoli presentati alla COMSOL Conference 2025
Geothermal energy systems require precise sizing to ensure efficiency and sustainability, particularly for probe fields and groundwater doublets. We present two specialized applications developed using COMSOL Multiphysics’ Application Builder, leveraging the Heat Transfer and Groundwater ... Per saperne di più
Thermocouples are widely used in industry for process temperature measurement. Calibration drift is a well-known problem which adversely affects process control, particularly in harsh environments (e.g. high temperature). To overcome this, a mechanism for self-calibration of ... Per saperne di più
In the field of pasta drying, where accurate prediction of temperature and moisture content distribution is critical, the use of modeling and simulation plays a key role. This study aims to assess operational conditions that ensure the production of safe, high-quality pasta. An advanced ... Per saperne di più
Bitumen and asphalt durability is a critical concern in pavement engineering, particularly in the context of sustainability and carbon footprint reduction. Accurate prediction of the lifespan of these materials is essential for life cycle assessment (LCA) from cradle to grave. However, ... Per saperne di più
This work presents a comprehensive modeling and validation study of MEMS-based infrared (IR) emitter chips using a neural network-assisted inverse modeling approach in COMSOL Multiphysics. Starting from a single baseline chip geometry, a simulation model was developed that captures the ... Per saperne di più
The transfer molding process is a widely used method for encapsulating microelectronics and power semiconductor devices. In power electronics, it is gaining increasing importance, particularly in the automotive sector [1]. In transfer molding, an epoxy mold compound (EMC) is injected ... Per saperne di più
With the Creation, roll-out, and maintenance of COMSOL Simulation apps, the role of simulation engineers and departments is expanding to include responsibilities similar to those of software developers. Within our department, we have undergone this transformation and will share the key ... Per saperne di più
The reversible storage of hydrogen in metal hydrides represents an attractive technology for hydrogen-based energy systems. In addition to their application as pure hydrogen storage media, metal hydrides can also be used to develop thermochemical hydrogen compressors, which can be ... Per saperne di più
