Scopri come la simulazione multifisica viene utilizzata per ricerca e sviluppo

In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.


Visualizza gli articoli presentati alla COMSOL Conference 2020

AC/DC Electromagneticsx

Modeling of Thermal Load and Electric Fields in Microfocus X-Ray Tubes

Dr. Vladimir Burlaka1, Thorsten Fröba1
1X-RAY WorX GmbH, Siemensstraße 26, 30827 Garbsen, Germany

The thermal load on the system components is one of the technical problems in the development of microfocus X-ray tubes. To improve their stability in long-term use, it is important to understand the physical phenomena and their influence on the system stability and filament lifetime. To ... Per saperne di più

Thermo-Electrical Improvement of a MEMS-IR-Emitter Membrane

Toni Schildhauer1, Andreas T. Winzer1
1CiS Forschungsinstitut für Mikrosensorik GmbH, Erfurt, Germany

NDIR (Non-dispersive infrared) sensors are state of the art for measuring gas concentrations in the Mid-infrared spectrum, e.g. components of exhaled human breath. These sensors require fitting light sources. Micro light bulbs and other filament based light source are sensible to ... Per saperne di più

Challenges in the Simulation of Vacuum Processing Hardware

Juergen Weichart1, Thomas Tschirky1
1Evatec AG, Hauptstrasse 1a, CH-9477 Trübbach, Switzerland

Process Hardware for heating, etching and plasma deposition in vacuum processes on Silicon wafers or glass substrates face challenging requirements due to very shallow and extended structures. Molecular Flow calculations are used to evaluate staggered shields with the aim to protect ... Per saperne di più

Fluxgate Virtual Current Sensor

A. Lekdim1, D. Coutellier 1
1LEM Tech France

The paper describes how the fluxgate current sensor works and how it is built in the COMSOL Multiphysics® software. Four COMSOL® modules were used: -AC/DC Module: the magnetic field physic is used in order to apply the Ampere-Maxwell’s law to the different sensor components and to the ... Per saperne di più

Modeling PCB Based Inductive Position Sensors with the COMSOL® AC/DC Module

Seriem Sid-Ahmed1, Lorenzo Lugani1
1Melexis Technologies SA, Bevaix, Switzerland

The growing adoption of electric vehicles has led to increased exposure of cars to stray magnetic fields. To address this issue, inductive position sensors have emerged as a viable solution due to their inherent immunity to stray magnetic fields. Widespread adoption of the inductive ... Per saperne di più

Modeling of the Ladle Furnace Preheating with a Graphite Heating Rod

Sergey Semenov1, Patrick Namy1, Magnus Sievers2, Bernd Friedrich2, Veronika Djupvik3, Kjell Blandhol3
1SIMTEC, Grenoble, France
2IME Process Metallurgy and Metal Recycling, RWTH Aachen University, Aachen, Germany
3Elkem Technology, Kristiansand, Norway

This work, which is done in the framework of the SisAl Pilot EU project, presents the use of the COMSOL Multiphysics® software for simulating ladle furnace preheating. The SisAl Pilot project aims at optimising the silicon production in Europe by recycling materials and using a carbon ... Per saperne di più

3D Magneto-Thermo-Hydrodynamic Modeling of Arc Welding

Marc Le Gal La Salle1, Stephen Cadiou2, Muriel Carin2, Mickael Courtois2, Alexandre Brosse3
1Framatome DTIMLT, 69007 Lyon France and IRDL, UMR CNRS 6027, Univ. Bretagne Sud, 56321 Lorient France
2IRDL, UMR CNRS 6027, Univ. Bretagne Sud, 56321 Lorient France
3Framatome DTIMLT, 69007 Lyon France

In the nuclear industry, and particularly at Framatome, mastery of welding processes is essential. Framatome is one of the world leaders in this field and wants to improve even more. The work presented focuses on improving the TIG (Tungsten Inert Gas) welding process, and more ... Per saperne di più

Influence of Materials and Packaging Solutions on Thermal Behaviour of Power Modules

Giulio Galfré1, Chiara Spano2, Paolo Aufiero1, Valentina Bertana1
1Politecnico di Torino
2Politecnico di Torino, VISHAY Semiconductor Italiana S.P.A

Nowadays, designing ever more efficient power modules requires complex materials and more innovative methodologies. To significantly reduce the lead time of the devices and decrease the costs, especially during the prototyping and the testing phases, a Finite Element Analysis (FEA) can ... Per saperne di più

Investigation of Electromigration in Fine-Pitch Copper Interconnects through Simulation and Analysis

Adrija Chaudhuri1, Marius van Dijk1, Johannes Jaeschke 1, Hermann Oppermann 1, Martin Schneider-Ramelow 2
1Fraunhofer Institute for Reliability and Microintegration (IZM), Berlin, Germany
2Research Center of Microperipheric Technologies, Technische Universität Berlin, Berlin, Germany

The scaling down of Copper interconnects is an effective approach to increasing the number of signal I/O lines and performance in advanced fine-pitch packaging. However, as dimensions are reduced, the risk of electromigration-induced failures in the copper interconnects becomes ... Per saperne di più

Frequency-Controlled Manipulation of Particles in a Liquid Column Based on AC Dielectrophoresis

I. Kuehne1, N. Philippin1, A. Frey2
1Heilbronn University of Applied Sciences, Kuenzelsau, BW, Germany
2Augsburg Technical University of Applied Sciences, Augsburg, BY, Germany

In this paper, the topic of frequency-controlled manipulation of sinking particles in a stationary liquid column based on AC dielectrophoresis is studied in depth. Particles sink downwards within a liquid column due to the gravitational force. In doing so, they are subjected to Stokes ... Per saperne di più