COMSOL Conference 2026 Proceedings
Collection of Papers, Posters, and Slideshows Accepted by the Program Committee
Alla COMSOL Conference 2026, ingegneri, ricercatori e scienziati di tutto il mondo hanno presentato il loro lavoro di simulazione, con applicazioni in tutti i principali settori industriali e nel mondo accademico. Utilizza lo strumento di ricerca rapida per trovare una presentazione specifica oppure filtra i contenuti per argomento o sede dell’evento.
Microfluidic systems traditionally rely on fixed physical barriers to manipulate fluids and particles. While effective, these static structures lack the flexibility required for dynamic or multifunctional applications. In this work, recently published in Nature Photonics [1], we present ... Per saperne di più
Retention force and its frictional contribution influence on the plug-socket connection stability Aikaterini Tziotziou*, Oleg Antoniuk, Bas Haayen, Michele Colloca Receiver and RIC Development Department, Modeling and Simulation Team, Sonion Nederland, B.V. The plug-socket connection ... Per saperne di più
The thermo-hydraulically coupled code COMSOL-VIPER (Kröhn and Fromme 2023) based on the balance equations of the experimental VIPER code (Kröhn 2011) for simulating water uptake by bentonite has been further advanced. Bentonite is of particular interest as a geotechnical barrier against ... Per saperne di più
Stray light represents a significant challenge in a wide range of photodiode and photodiode array applications, as it elevates the background signal, reduces detector sensitivity, and degrades the signal-to-noise ratio. Traditional approaches to mitigate stray light, such as blackening ... Per saperne di più
This study presents a combined simulation and experimental investigation of mixing performance in a batch mixer, with the goal of validating simulation results and identifying optimization potential. The focus is on evaluating mixing times and flow fields to enhance process efficiency, ... Per saperne di più
The transfer molding process is a widely used method for encapsulating microelectronics and power semiconductor devices. In power electronics, it is gaining increasing importance, particularly in the automotive sector [1]. In transfer molding, an epoxy mold compound (EMC) is injected ... Per saperne di più
With the Creation, roll-out, and maintenance of COMSOL Simulation apps, the role of simulation engineers and departments is expanding to include responsibilities similar to those of software developers. Within our department, we have undergone this transformation and will share the key ... Per saperne di più
Silicon epitaxy (EPI) is an important process in semiconductor industry. We investigate the gas flow and gas composition in a complex 3D EPI reactor using the COMSOL's Laminar Flow, coupled with Transport of Concentrated Species, as well as the gas mixture properties provided by the ... Per saperne di più
