COMSOL Conference 2026 Proceedings
Collection of Papers, Posters, and Slideshows Accepted by the Program Committee
Alla COMSOL Conference 2026, ingegneri, ricercatori e scienziati di tutto il mondo hanno presentato il loro lavoro di simulazione, con applicazioni in tutti i principali settori industriali e nel mondo accademico. Utilizza lo strumento di ricerca rapida per trovare una presentazione specifica oppure filtra i contenuti per argomento o sede dell’evento.
Groundwater-bearing geological layers respond to and modify the surface expressions of magmatic activity, and they can also become agents of volcanic unrest themselves. Interpretations of unrest signals as groundwater responses to changes in the magmatic system can be found for many ... Per saperne di più
In this paper describes an original method for indirect measurement of the vapor pressure and temperature in the keyhole in electron beam welding. This method is based on the determination of the concentration of chemical elements in the vapor above the welding zone. Taking into account ... Per saperne di più
Air permeability is one of the most important parameters in the study of thermo-physiological comfort of fabrics. The main goal of this work is to develop a virtual process that allows the prediction of air permeability of any fabric without realizing a sample. The Free and Porous Media ... Per saperne di più
The flow field of a coaxial jet with the internal (primary) flow being subsonic and the external (secondary) flow being supersonic has been investigated with COMSOL Multiphysics® software. We used the results to correct defects in the nozzle geometry and we evaluated the effect of heat ... Per saperne di più
The problem under investigation is electrical scale-up of a generic metallurgical process for primary metal production through resistive heating of slag by electric current, typically supplied by an AC three-phase system. Maxwell’s equations are analyzed revealing that the properties of ... Per saperne di più
Usually, in integrated circuits, the chip is brazed on leadframe and then, a polymer resin is molded around to create the packaging. On the first hand, the molding process at high temperatures will induce thermomechanical stress on the chip. As the leadframe, the chip and the braze have ... Per saperne di più
As the importance of nanoparticles is growing more and more, controlling and understanding the properties of nanoparticles became a focus of research. In this field Meyer at al. [1] are researching the GMR effect in granular gels to develop magnetoresistive sensors. The GMR in granular ... Per saperne di più
Simulation of components and processes becomes more and more important in industry; therefore it is necessary to train young engineers how to apply simulation software. We established two consecutive courses for graduate students in which we decided to focus on COMSOL Multiphysics®, ... Per saperne di più
