In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.

Computational Analysis of Evaporation in Tailored Microchannel Evaporators

S. Arslan[1], J. Brown[1]
[1]Lawrence Technological University, Southfield, MI, USA

The rapid increase in power densities of integrated circuits has induced a significant interest in new reliable and high heat flux cooling technologies. The implication of such growth is the increased need for more efficient and more compact cooling mechanisms. Promising research has been conducted in the area of MEMS cooling devices, taking advantage of the increased heat transfer ...

Modeling the Effect of Discrete Distributions of Platinum Particles in the PEM Fuel Cell Catalyst Layer

C.F. Cetinbas[1], A.K. Prasad[2], S.G. Advani[1]
[1]Center for Fuel Cell Research, Department of Mechanical Engineering, University of Delaware, Newark, DE, USA
[2]University of Delaware, Newark, DE, USA

In this study, the basic catalyst layer (CL) structure, consisting of carbon-supported Pt particles (C|Pt) and an ionomer binder, is investigated numerically by using COMSOL. The significance of modeling discrete Pt particles on the carbon support is highlighted by comparing the cell performance results to the case in which the Pt is assumed to be distributed uniformly over the carbon support as ...

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a freestanding flexible substrate such as polyimide would distort unacceptably during even minor temperature excursions ...

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