In questa sezione troverete i lavori presentati alle Conferenze mondiali COMSOL. Le presentazioni descrivono ricerche e prodotti innovativi progettati con COMSOL Multiphysics da colleghi di tutto il mondo. I temi delle ricerche presentate abbracciano un'ampia gamma di settori produttivi e aree applicative, in ambito elettrico, meccanico, fluidodinamico e chimico. Lo strumento di Ricerca Rapida vi permetterà di trovare le presentazioni che si riferiscono all'area di vostro interesse.

Numerical Modeling of Pit Growth in Microstructure

S. Qidwai[1], N. Kota[2], V. DeGiorgi[1]
[1]Naval Research Laboratory, Washington, DC, USA
[2]Science Applications International Corporation, Washington, DC, USA

Pitting corrosion is a complex phenomenon where rates of: i) chemical reactions, ii) diffusion of various species involve in those reactions, and iii) species dissolution at the metal-electrolyte interface are fully dependent on each other, except under special conditions or assumptions. One set of such conditions is that: a) there are no species concentration gradients due to the rapid mixing ...

Thermal Analysis of Packaged Deep Ultraviolet LEDs

A. Dobrinsky[1], M. Shatalov[1], M. Shur[1], R. Gaska[1]
[1]Sensor Electronic Technology, Columbia, SC, USA

Deep Ultraviolet Light Emitting Diodes (DUV LEDs) are presently operating at a relatively low efficiency, thus large amount of LED driving power is dissipating in heat. Thermal heating degrades LED performance and decreases LED’s lifetime. The degradation of DUV LED devices with temperature increase makes thermal management a key issue for DUV LEDs. We present a thermal analysis of DUV LED ...

Electromagnetic Release Process for Flexible Electronics

G. Coryell[1][,][2]
[1]School for Engineering of Matter, Transport, and Energy, Arizona State University, Tempe, AZ, USA
[2]Chemistry Department, United States Naval Academy, Annapolis, MD, USA

Flexible electronics are temporarily affixed to a rigid carrier such as glass or silicon prior to device fabrication to facilitate robotic handling of the device, but also to allow optical lithography to stay within overlay design registration budget; without the rigid carrier, a freestanding flexible substrate such as polyimide would distort unacceptably during even minor temperature excursions ...

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