Presentazioni e Articoli Tecnici

Electrochemical systems are devices or processes in which an ionic conductor mediates the interconversion of chemical and electrical energy. This paper presents a model to simulate the electroplating of copper in a microcavity typically found in the plating of copper onto circuit boards.

We use COMSOL Multiphysics^® simulation software to plot the thickness of the deposition along the vertical cathode boundaries, get the meshes of the model, and potential distribution.

We successfully demonstrate the use of moving meshes for plating processes and we investigate the influence of the cavity on the plating result. The moving mesh makes it possible to simulate the growth of the cathode boundary as the process is carried out.