CFD Analysis of a Printed Circuit Heat Exchanger

K. Wegman [1], X. Sun [1],
[1] Department of Mechanical and Aerospace Engineering, Ohio State University, Columbus, OH, USA
Published in 2015

In this experiment, the performance of a Printed Circuit Heat Exchanger (PCHE) was studied using COMSOL Multiphysics® software. PCHEs are diffusion bonded heat exchangers containing semicircular, chemically etched flow paths. Helium was used as the working fluid on both the hot and cold sides. A simplified model was used in the simulation, and the results were compared to experimental results. Both laminar and turbulent models were employed in the simulation coupled with conjugate heat transfer in solids. Despite the simplifications made in the model, the simulation results show promising results compared to the experimental results. The simulated Nusselt number predictions are very accurate, while the more locally dependent friction factor values are less accurate. Further study will be performed investigating a full geometry model with enhanced meshes.