La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
In this tutorial, the vibrational behavior of a small aluminum plate with four waveguide structures is analyzed. This is an example of a structural component located in a device where elastic waves are propagating, like a smart speaker, an electric motor, or a MEMS device. The plate can ... Per saperne di più
The model studied is a benchmark for a hinged cylindrical panel subjected to a point load at its center. A linear buckling analysis predicts the critical buckling load. Such an analysis will however not give any information about what happens at loads higher than the critical load. ... Per saperne di più
This example shows how to model prestressed bolts. The bolt geometry is taken from the Part Libraries. For comparison, one of the bolts is modeled using a thread contact formulation, whereas the other bolt is connected to the bolt hole by a pure continuity condition. The reduced ... Per saperne di più
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Per saperne di più
The External Material functionality makes it possible to program your own material models for cases when the built-in material models are not sufficient. For structural mechanics, you have the possibility to either completely define the material model in a domain, or to add an inelastic ... Per saperne di più
In this example, the homogenized elastic and thermal properties of a composite material based on a triply periodic minimal surface (TPMS) are computed. A gyroid TPMS-based unit cell is subjected to periodic boundary conditions to get the homogenized material properties. The effects of ... Per saperne di più
In this benchmark example, a semi-elliptical crack at the inner surface of a cylinder is studied. The inside of the cylinder and the crack faces are subjected to a pressure load. The J-integral is calculated along the crack front, and the stress intensity factor is then compared with the ... Per saperne di più
This example shows how to use response spectrum analysis to verify the integrity of a structure that is exposed to an earthquake. The building is modeled as a steel frame, using beam elements. Displacements and stresses are computed. Per saperne di più
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Per saperne di più
This example shows how to implement a stress dependent material model. The Young's modulus changes based on the stress value. Per saperne di più