La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This example illustrates a linear buckling analysis conducted for a corrugated conical shell, utilizing a single sector of the geometry along with cyclic symmetry periodicity edge conditions. The results are compared to those using the full shell geometry. Per saperne di più
The homogenized material properties of a composite are computed based on the temperature-dependent properties of matrix and fiber. The homogenized parameters are compared to the analytical values derived from the rule of mixtures. This is an extension of model https://www.comsol.com ... Per saperne di più
This model showcases a nail penetration experiment into a layered battery. It couples the Solid Mechanics, Lithium-Ion Battery, and Heat Transfer interfaces. A nail is punched into a sandwiched battery consisting of two electrodes and a separator. As soon as the nail connects both ... Per saperne di più
This is a demo model to show how to model connections in a mechanical system using Multibody Dynamics interface. In this model, pantograph mechanism is modeled. The purpose of this mechanism is to produce an identical, either enlarged or miniaturized, copy of an existing drawing. Per saperne di più
In this model, the stress concentrations around a superelliptic hole in a thin plate are investigated. To learn more about this model, see our accompanying blog post “Stress Concentrations Around a Superellipse”. Per saperne di più
This model demonstrates how to extract the lumped parameters for an mBVD equivalent circuit from a FEM simulation and how to leverage such a model directly using the Electrical Circuit interface. A 3D layered FBAR resonator is considered as an example. Related Blog Post Leveraging the ... Per saperne di più
In direct bonding, the in-plane relative displacement between corresponding points on the bonding surfaces of the top and bottom wafers, denoted as IPD (In-Plane Distortion), is the primary yield killer in the bonding process. This model can predict the entire direct wafer bonding ... Per saperne di più
Flip chip (FC) is a widely-used form of advanced semiconductor packaging, which yields small size, high interconnection density, and good signal transmission performance of the semiconductor device. In FC devices, the chip is placed face down and directly bonded to the substrate, or ... Per saperne di più
