La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Per saperne di più
For slender structures, buckling is a catastrophic instability if the service load is above the critical limit. For such structures, it can be important to study the behavior of the structure beyond the critical buckling load, which is known as postbuckling analysis. Tracing the ... Per saperne di più
This is a benchmark model involving stick-slip friction of a ring rolling inside another ring. The displacement of the inner ring is computed and compared to the analytical result. This model also shows how to tackle friction dominated contact problem. Per saperne di più
An acoustic point source emits a pressure wave in water that travels toward a piece of glass. Cracks are formed and propagate due to high tensile stresses developed in the glass. A fully coupled acoustic-structure interaction problem including phase field damage in solids is solved in ... Per saperne di più
This model illustrates how to perform prestressed eigenfrequency and frequency response analyses in a contact problem. A circular plate is squeezed between two thicker plates. The peak of the prestressed frequency response analysis is compared with the prestressed eigenfrequencies as ... Per saperne di più
The four-point bending test is a conventional test method used to test the mechanical properties of materials subjected to bending. It is a reliability test used for semiconductor packaging and assembly. This model demonstrates the stress analysis of an IGBT module subjected to a four ... Per saperne di più
Interference fit is a technique used to join or fit one part over or around another part. The internal part is cooled, so that it shrinks, and is then fitted. Once the part heats up again and expands, a contact pressure builds up at the interface between the two parts. This type of ... Per saperne di più
This model studies the natural frequencies of a pre-tensioned string using the 2D Wire interface. This is an example of “stress stiffening”; in fact the transverse stiffness of wire elements is directly proportional to the tensile force. Strings made of piano wire have an extremely high ... Per saperne di più
This example studies the deformation of a hemispherical shell, where the loads cause significant geometric nonlinearity. The maximum deflections are more than two magnitudes larger than the thickness of the shell. The problem is a standard benchmark, used for testing shell formulations ... Per saperne di più
This model shows a full vibroacoustic analysis of a loudspeaker including driver, cabinet, and stand. It lets you apply a nominal driving voltage and extract the resulting sound pressure level in the cabinet and in the outside room, as well as the deformation of the cabinet and driver, ... Per saperne di più