La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
In many structural dynamics applications, some components are stiff compared to the supporting structure. Such a stiff part will only contribute to the dynamic properties of the structure through its mass and moment of inertia. It is then possible to reduce the model size significantly ... Per saperne di più
The propagation of elastic waves in the ground after a seismic event is simulated using a 2D model. The effect of the ground surface topology on the wave propagation is illustrated when an ideal half-space is modified with the presence of a small mountain. The model is a variation of ... Per saperne di più
A contactor wedge is subject to a gravity load and is forced to slide due to a boundary load over a rigid target wedge surface, both infinitely wide. Horizontal linear springs are also connected between the left vertical boundary and the ground. This is a large sliding problem including ... Per saperne di più
A fuel cell stack operates at temperatures just below 100 °C, which means that it has to be heated at start-up. The fuel cell stack consists of unit cell of anode, membrane, and cathode connected in series through bipolar plates. This study presents a model that couples the thermal and ... Per saperne di più
As integrated circuit (IC) technology advances, with circuits becoming more powerful and compact, it is increasingly important to identify and prevent any cause of circuit failure. One particularly critical factor contributing to circuit failure is electromigration within the ... Per saperne di più
The ball grid array (BGA) technology is a surface-mount technology widely used in electronic packaging. Usually, there are two types of solder balls considered in the array, including the functional balls that are required for electric connections and the support balls that are used only ... Per saperne di più
The eigenfrequencies of a rotating blade are studied in this benchmark. It shows how stress stiffening and the combined effect from stress stiffening and spin softening affects the fundamental eigenfrequency. High rotational speed in rotating machineries can result in centrifugal forces ... Per saperne di più
The External Material functionality makes it possible to program your own material models for cases when the built-in material models are not sufficient. For structural mechanics, you have the possibility to either completely define the material model in a domain, or to add an inelastic ... Per saperne di più
The model studied is a benchmark for a hinged cylindrical panel subjected to a point load at its center. A linear buckling analysis predicts the critical buckling load. Such an analysis will however not give any information about what happens at loads higher than the critical load. ... Per saperne di più
This is a benchmark model involving stick-slip friction of a ring rolling inside another ring. The displacement of the inner ring is computed and compared to the analytical result. This model also shows how to tackle friction dominated contact problem. Per saperne di più
