La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This example uses the thermal expansion of a laminated composite shell model to demonstrate the use of the feature Thermal Contact, Interface, applied on interfaces between layers in a laminated composite shell. The first study is computed neglecting this additional thermal resistance in ... Per saperne di più
A 3D model of an acoustic trap in a glass capillary actuated by a piezoelectric transducer. The system is actuated by an oscillating electric potential across the piezoelectric transducer inducing mechanical vibrations in the solid and an acoustic pressure field in the fluid. The heat ... Per saperne di più
In this example, a heterogeneous NMC (Nickel-Manganese-Cobalt) electrode structure is generated from tomography data using a Model Method. Time-dependent discharge and electrochemical impedance spectroscopy (EIS) simulations are then made on the full 3D geometry. A solid mechanics ... Per saperne di più
In the semiconductor manufacturing process, photoresist coating is an important process and the thickness of the photoresist layer needs to be precisely controlled. Usually, the photoresist layer is thinned by spin coating. The specific principle is to use centrifugal force to throw ... Per saperne di più
Prior to the reliability testing, surface-mount devices (SMDs) are required to go through a preconditioning process, which represents the effects of storage and the typical reflow operation in the following board assembly process. During the preconditioning process, test samples usually ... Per saperne di più
The Czochralski (CZ) method is one of the most important methods for the preparation of monocrystalline silicon. The shape of the crystal, especially the diameter, is controlled by carefully adjusting the heating power, the pulling rate, and the rotation rate of the crystal. This model ... Per saperne di più
Reflow soldering is an important process in IC packaging. In reflow soldering, the solder materials are melted to create joints between electrical components and the PCBs for structural and electrical connections. This model demonstrates the process of attaching chips to a PCB by reflow ... Per saperne di più
This model studies a small orifice located in a duct. The transmission and reflection coefficients of the system are computed in the presence of a bias flow using the linearized Navier-Stokes equations. For certain frequencies the transmission coefficient shows amplification (T>1). This ... Per saperne di più
This model is used on "Heat Transfer with Radiation in Participating Media and the Discrete Ordinates Method" to compare quadrature sets used in the method of discrete ordinates. To assess the performance of quadrature sets in complex geometries, results of incident irradiation and ... Per saperne di più
This is a model of a simple thermoacoustic engine that includes a thermal stack to convert thermal energy to acoustic energy. The model is set up using two approaches: 1) Using a linear perturbation (acoustic) approaches solving the fluid motion with the Thermoviscous Acoustics, ... Per saperne di più