La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This tutorial shows how to solve the full time-dependent wave equation in dispersive media such as plasmas and semiconductors. The 2D TM in-plane wave model solves for the vector potential from the wave equation and for an auxiliary electric polarization density from an ordinary ... Per saperne di più
This example demonstrates how an ESD event causes logic error of a microchip on a PCB board. The ESD current is based on the extended HBM (Human Body Model) and it is predefined in the Lumped Port feature. Per saperne di più
This tutorial model demonstrates how to use the Combined Inductively/DC Discharge interface to simulate the plasma generated in a pulsed arc. This modeling technique is useful for a large range of industrial applications including cutting, welding, spraying, waste destruction, and ... Per saperne di più
This model demonstrates how to couple the Semiconductor interface to the Heat Transfer in Solids interface. A thermal analysis is performed on the existing bipolar transistor model in the case when the device is operated in the active-forward configuration. The Semiconductor interface ... Per saperne di più
This model demonstrates the "butterfly" filling mechanism for copper electrodeposition in a Through-Hole (TH) via exposed to an electrolyte containing halide-suppressor additives. The Tertiary Current Distribution, Nernst Planck interface in combination with Deformed Geometry is used ... Per saperne di più
Electrochemical codeposition is a common low-cost method for producing metal alloys. This tutorial model demonstrates electrodeposition of a nickel (Ni)–phosphorous (P) alloy. The model accounts for charge and mass transport of a multitude of species along with multiple electrode ... Per saperne di più
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Per saperne di più
The electron energy distribution function (EEDF) plays an important role in the overall behavior of discharges. Analytic forms of the EEDF exist such as Maxwellian or Druyvesteyn, but in some cases they fail to fit the discharge physics. This tutorial model investigates the effects of ... Per saperne di più
