La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... Per saperne di più
This example describes the cooling and solidification, from melt to solid metal, in a continuous casting process. The model includes nonisothermal properties, temperature distribution, flow field, and phase change. This example uses the arbritrary Lagrangian-Eulerian method for modeling ... Per saperne di più
The heat exchanger in this tutorial model contains a dynamic wall with an oscillating wave shape. The deformation induces mixing in the fluid and reduces the formation of thermal boundary layers. Hence, it increases heat transfer between the walls and the fluid. In addition, the wave ... Per saperne di più
This example shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach, the thin domains are modeled with thermal resistors in the Lumped Thermal System ... Per saperne di più
This tutorial model uses a heat sink geometry from the Part Library. The tutorial shows different approaches to heat transfer modeling when studying the cooling of an electronic chip. In the first part, only the solid parts are modeled, while the convective airflow is modeled using ... Per saperne di più
This model simulates a static analysis of heat conduction in a thin conductive shell. This is a benchmark model where the result is compared with a NAFEMS benchmark solution. Per saperne di più
This example is a variant of the Composite Thermal Barrier tutorial and shows how to set up multiple sandwiched thin layers with different thermal conductivities in two different ways. First, the composite is modeled as a 3D object. In the second approach the Lumped Thermal System ... Per saperne di più
This example computes the effectiveness of a porous microchannel heat sink over a conventional microchannel heat sink. The model is fully parameterized. A parameter study on the thickness of the porous substrate is used to determine the optimal configuration. Per saperne di più
Maximizing product yield is a main task in chemical reaction engineering. This can be especially challenging if the desired product, once formed, can be consumed by further reactions. This example investigates such a series reaction as it occurs in a tubular reactor. You will start by ... Per saperne di più
This model shows how you can use the Non-Isothermal Pipe Flow interface together with the Heat Transfer in Solids interface to model the cooling of a injection molded polyurethane part for a car steering wheel. The equations describing the cooling channels are fully coupled to the heat ... Per saperne di più