La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This example involves a static 2D axisymmetric analysis of a piezoelectric actuator using the Piezoelectric Devices physics interface. It models a radially polarized piezoelectric tube, as described by S. Peelamedu and co-authors. An application area where radially polarized tubes are ... Per saperne di più
This example shows how to set up a piezoelectric transducer problem following the work of Y. Kagawa and T. Yamabuchi. The composite piezoelectric ultrasonic transducer has a cylindrical geometry that consists of a piezoceramic layer, two aluminum layers, and two adhesive layers. The ... Per saperne di più
In this example, phase transformation data and phase material properties are imported from JMatPro, and used to compute CCT curves. Dilatometry curves (axial thermal strain) are computed across a range of cooling rates. Per saperne di più
This transient model uses the Two-Phase Flow, Level Set, Laminar Flow interface to model the impact of a water wave on a column. A body of water with a height of 0.3 meters is initially contained behind a gate. At the start of the simulation, the gate is suddenly released and the body of ... Per saperne di più
Induced eddy currents and associated thermal loads is of interest in many high power AC applications. This example is of general nature and illustrates some of the involved physics as well as suitable modeling techniques in the AC/DC Module. In this model a metallic plate is placed ... Per saperne di più
Including circumferential displacements in a 2D axisymmetric Solid Mechanics interface allows to compute twist and bending deformations. This model determines stress concentration factors for a hollow shaft for load cases of axial extension, torsion, as well as bending, using a ... Per saperne di più
Ion implantation is used extensively in the semiconductor industry to implant dopants into wafers. Within an ion implanter, ions generated within an ion source are accelerated by an electric field to achieve the desired implant energy. Ions of the correct charge state are selected by ... Per saperne di più
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Per saperne di più
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Per saperne di più
For slender structures, buckling is a catastrophic instability if the service load is above the critical limit. For such structures, it can be important to study the behavior of the structure beyond the critical buckling load, which is known as postbuckling analysis. Tracing the ... Per saperne di più