La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
While transient analyses are useful for time domain reflectometry (TDR) to handle signal integrity (SI) problems, many RF and microwave examples are addressed using frequency domain simulations generating S-parameters. However, from the frequency domain data it is difficult to identify ... Per saperne di più
The drive for miniaturizing electronic devices has resulted in today’s extensive use of surface-mount electronic components. An important aspect in electronics design and the choice of materials is a product’s durability and lifetime. For surface-mount resistors and other components ... Per saperne di più
In this model a Knowles ED23146 receiver (miniature loudspeaker) is connected to a test set-up consisting of a 50 mm (1 mm diameter) earmold tube and a so-called 0.4-cc coupler. The receiver is modeled using a lumped spice network and connected to the finite element domain at the tube ... Per saperne di più
This is a model of a moving-coil loudspeaker where a lumped parameter analogy represents the behavior of the electrical and mechanical speaker components. The Thiele-Small parameters (small-signal parameters) serve as input to the lumped model, which is represented by an Electric Circuit ... Per saperne di più
A Touchstone file describes the frequency responses of an n-port network circuit in terms of S-parameters. This can be used to simplify arbitrarily complex circuits. The Touchstone file can be obtained from numerical simulations or network analyzer measurements. The obtained file for a ... Per saperne di più
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Per saperne di più
Example of a moving-coil loudspeaker where lumped parameters represent the behavior of the electrical and mechanical components. The Thiele-Small parameters (small-signal parameters) serve as input to the lumped model, which is represented using the Electric Circuit interface. The ... Per saperne di più
This model analyzes the thermal expansion in a MEMS device, such as a microgyroscope, where thermal expansion should be minimized. The device is made from the copper-beryllium alloy UNS C17500 and uses temperature-dependent material properties from the Material Library. The purpose of ... Per saperne di più
This is the transient model of a single phase E-core transformer using a homogenized approach for the multi-turn primary and secondary coils. The model includes the effect of magnetic saturation (B-H curve) in the core and shows how to connect the transformer model to the external ... Per saperne di più
COMSOL Multiphysics provides an interactive meshing environment where, with a few mouse clicks, you can easily mesh individual faces or domains. Each meshing operation is added to the meshing sequence. The final mesh is the result of building all the operations in the meshing sequence. ... Per saperne di più