La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This model simulates an LED that emits in the infrared part of the electromagnetic spectrum. The device structure is made up of a single p-n junction formed by a layer of p-type doping near the top surface of an otherwise n-type wafer. This kind of device geometry is simple and cheap to ... Per saperne di più
When anodizing aluminum, the surface is electrochemically altered to form an abrasive and corrosion-resistive Al2O3 film. The electrode kinetics during the process are only marginally affected as the oxide layer grows, so a stationary analysis of the current distribution is sufficient to ... Per saperne di più
This example was originally formulated by Albert Witarsa under Professor Bruce Finlayson’s supervision at the University of Washington in Seattle. It was part of a graduate course in which the assignment consisted of evaluating the potential of patents in the field of microfluidics ... Per saperne di più
Passive devices can be designed using lumped element features if both the operating frequency of the device and the insertion loss of lumped elements are low. This example simulates two types of lumped element filters that are similar to lumped ports, except that they are strictly ... Per saperne di più
This model shows how to combine different types of material nonlinearity, such as creep and elastoplasticity. In this specific example you will perform a stress and nonlinear strain analysis on a thick cylinder under a nonproportional loading: an initial temperature increase followed by ... Per saperne di più
This model demonstrates the impact of convection and diffusion on the transport-limited electrodeposition of a copper microconnector bump (metal post). Microconnector bumps are used in various types of electronic applications for interconnecting components, for instance liquid crystal ... Per saperne di più
Surface plasmon-based circuits are being used in applications such as plasmonic chips, light generation, and nanolithography. The Plasmonic Wire Grating Analyzer application computes the coefficients of refraction, specular reflection, and first-order diffraction as functions of the ... Per saperne di più
Marangoni convection occurs when the surface tension of an interface (generally liquid-air) depends on the concentration of a species or on the temperature distribution. In the case of temperature dependence, the Marangoni effect is also called thermo-capillary convection. The Marangoni ... Per saperne di più
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Per saperne di più
The present model example is based on Copper Deposition in a Trench model available in Electrodeposition Application Library. The nonuniform deposition along the trench surface leads to formation of a cavity/void. Since the Deformed Geometry interface cannot handle topological changes, ... Per saperne di più