La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
A steel billet is quenched in oil from its austenitic state. A 2D axisymmetric model is used to simulate the coupled problem of austenite decomposition, heat transfer, and solid mechanics. During the quenching process, the austenite decomposes into a combination of ferrite, pearlite, ... Per saperne di più
Surface micromachined thin films are often subject to residual stress. This COMSOL Multiphysics example describes a thin film resonator with straight or folded cantilever beam springs. The resonance frequencies of the resonator are affected by thermal stress. Using folded springs ... Per saperne di più
Thermoelectric elements are often used to cool or heat electronic components to a desired temperature. In such simulations, you are typically not interested in the behavior of the thermoelectric element itself but want to use its performance characteristics to model the overall response ... Per saperne di più
This example demonstrates how to use temperature dependent materials within the Nonlinear Structural Materials Module. A large container holds pressurized hot water. Several pipes are attached to the pressure vessel. Those pipes can rapidly transfer cold water in case of an emergency ... Per saperne di più
This model is a benchmark model for the Slip Flow interface. It is based on both analytic and numeric calculations. Air at atmospheric pressure flows through a conducting micro-channel connecting two reservoirs maintained at different temperatures. A flow between the two reservoirs ... Per saperne di più
This problem follows a typical preliminary board-level thermal analysis. First perform a simulation of the board with some Integrated Circuits (ICs). Then, add a disk-stack heat sink to observe cooling effects. Finally, explore adding a copper layer to the bottom of the board in order to ... Per saperne di più
Carbon deposition on the surface of solid catalysts is commonly observed in hydrocarbon processing. A known problem is that carbon deposits can impede the activity of catalysts as well as block the flow of gas through a catalyst bed. This example investigates the thermal decomposition ... Per saperne di più
Modern integrated circuits are available as plastic encapsulated microcircuits (PEM). These devices are molded out of polymeric materials and epoxy resins in order to protect the internal semiconductors. Unfortunately, polymeric mold compounds absorb moisture when exposed to a humid ... Per saperne di più
This model is an introduction to defining and verifying a satellite orbit, and computing the solar, albedo, and Earth infrared thermal loads. A 1U CubeSat is in a circular orbit at 400km altitude, inclination of 50°, and longitude of ascending node of 0°. The satellite is rotating slowly ... Per saperne di più
An electron gun must be able to draw a sufficient current and accelerate the electrons to the desired speed. The first part of an electron gun geometry presents unique design challenges because the emitted electron speeds are usually lowest there, and therefore the space charge density ... Per saperne di più