La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This app demonstrates the following: Geometry parts and parameterized geometry A results table form object containing outputs Finned pipes are used for coolers, heaters, or heat exchangers to increase heat transfer. They come in different sizes and designs depending on the ... Per saperne di più
This entry is a compilation of some examples from DIN EN 1991-1-2 (Actions on structures exposed to fire). Models that are included: 1. Cooling (HT) 2. Heating (HT) 3. Heat transfer through multiple layers (HT) 4. Thermal elongation (SME, thermal stress) 5. Thermal expansion (SME, HT, ... Per saperne di più
When producing glass, the glass melt is cooled down through radiation to form the final shape, subjecting it to stresses. Numerical treatment of radiative heat transfer, using the Radiative Transfer Equation (RTE), helps to optimize this process. COMSOL Multiphysics provides three ... Per saperne di più
Electromagnetic heating is ideally suited for modeling in COMSOL Multiphysics. This model shows the area of hyperthermic oncology but the modeling issues and techniques are generally applicable to any problem involving electromagnetic heating. The purpose of this model is to compute the ... Per saperne di più
In massive forming processes like rolling or extrusion, metal alloys are deformed in a hot solid state with material flowing under ideally plastic conditions. Such processes can be simulated effectively using computational fluid dynamics, where the material is considered as a fluid with ... Per saperne di più
All integrated circuits (ICs) — especially high-speed devices — produce heat. In today’s dense electronic system layouts, heat sources are many times placed close to heat-sensitive ICs. Designers of printed circuit boards often need to consider the relative placement of heat ... Per saperne di più
This model treats the free convection of argon gas within a light bulb. It shows the coupling of heat transport (conduction, radiation and convection) to momentum transport (non-isothermal flow) induced by density variations caused by temperature. COMSOL Multiphysics model makes it ... Per saperne di più
The suite of models examine the air cooling of circuit boards populated with multiple integrated circuits (ICs), which act as heat sources. Two possible cooling scenarios are depicted: vertically aligned boards using natural convection, and horizontal boards with forced convection (fan ... Per saperne di più
The response of a millimeter wave with frequencies of 35 GHz and 95 GHz is known to be very sensitive to water content. This model utilizes a low-power 35 GHz Ka-band millimeter wave and its reflectivity to moisture for noninvasive cancer diagnosis. Since skin tumors contain more ... Per saperne di più
This 2D stationary model computes heat and moisture transport in a wall composed of different hygroscopic materials. A comparison with the Glaser method is given for the temperature and relative humidity solutions. The effect of the use of a vapor barrier is also investigated. Per saperne di più
