La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This model presents a way to compute projected area using the Surface-to-Surface Radiation interface of the Heat Transfer Module. By computing illuminated area from a set of directions on a discretized sphere, it is possible to interpolate the projected area onto any angle of incidence. ... Per saperne di più
This model analyzes the uncertainty in focused ultrasound induced tissue heating. The material properties for the tissue mimicking material, including the uncertainty, are taken from the FDA Medical Device Development Tool: Tissue Mimicking Material (TMM) for Preclinical Acoustic ... Per saperne di più
Thermally induced transformations in solids may be modeled by using an Arrhenius law to express the dependence on temperature of the transformation rate. This tutorial model shows how to use the Irreversible Transformation subfeature, available under the Solid feature of the Heat ... Per saperne di più
Phase change between a liquid or gas and a solid phase is an important phenomenon that is observed in various process across industries. When modelling such phase change, it can be important to account for the difference in density of the solid and fluid phase in order to ensure mass ... Per saperne di più
Flip chip (FC) is a widely used form of advanced semiconductor packaging that yields high interconnection density and good signal transmission performance of the semiconductor device as well as a reduction in size. In FC devices, the chip is placed face down and directly bonded to the ... Per saperne di più
