La Galleria delle Applicazioni raccoglie un'ampia varietà di tutorial e di app dimostrative realizzati con COMSOL Multiphysics in diversi ambiti applicativi, inclusi quelli elettrico, meccanico, fluidico e chimico. E' possibile scaricare i file dei modelli e delle app demo pronti all'uso e le istruzioni step-by-step per costruirli, e utilizzarli come punto di partenza per le proprie simulazioni.
Lo strumento di Ricerca Rapida permette di trovare i modelli che si riferiscono alla propria area di interesse.
Si noti che molti degli esempi qui presentati sono accessibili anche tramite le Librerie delle Applicazioni incorporate nel software COMSOL Multiphysics® e disponibili dal menu File.
This example model demonstrates shape optimization of a cavity filter using the Transformation feature, so the boundaries remain flat and angles do not change. The optimization considers both insertion loss and out-of-band rejection. The optimized shape is verified using a different mesh ... Per saperne di più
A circularly polarized GHz wave is incident on a layer of cold magnetized plasma. Depending on the operating frequency and plasma state, the incident wave can excite a set of waves with different polarizations. The resulting reflection and transmission characteristics can be of interest ... Per saperne di più
Cascaded cavity filters provide much better bandpass filter performance than single cavity filters. This example demonstrate how to use shape optimization to optimize three rectangular cavity filters coupled via slots. The calculated S-parameters show excellent out-of-band rejection. Per saperne di più
Permanent magnet manufacturers test magnets by applying a cyclic temperature load during the design process to assess the resulting thermal demagnetization. The heating process is usually slow enough that the temperature distribution inside the magnet can be considered uniform at any ... Per saperne di più
This model demonstrates how to extract the lumped parameters for an mBVD equivalent circuit from a FEM simulation and how to leverage such a model directly using the Electrical Circuit interface. A 3D layered FBAR resonator is considered as an example. Related Blog Post Leveraging the ... Per saperne di più
Flip chip (FC) is a widely-used form of advanced semiconductor packaging, which yields small size, high interconnection density, and good signal transmission performance of the semiconductor device. In FC devices, the chip is placed face down and directly bonded to the substrate, or ... Per saperne di più
