Prestress Analysis for Thermal Stress Analysis

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Hi All,

I am doing Prestress analysis of Power Module where after the soldering is done, we cool it down from 230 degC to 25 degC. Now because of this cooling, the power module will shrink and because of that there will be some stress in it. Now, when I use this power module and heat it from 65 degC to 130 degC, the stresses generated due to the shrinkage should be revealed from the power module. I am trying to replicate this scenario.

For that, I have performed the prestress simulation in COMSOL and I have added one more physics of Thermal Stress and one more study to perform the 2nd simulation. For the 2nd Simulation, I clicked on get initial value and ran the simulation. But this procedure does not seems to give me correct results. Does anyone know whether this method is correct or not? I have attached the photo here for your reference.



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