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Modeling Strain in a Thin Lamella Due to Differential Thermal Expansion
Posted 18 giu 2025, 10:06 GMT-4 Heat Transfer, Studies & Solvers, Physics Interfaces 0 Replies
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I'm looking for the optimal approach to model the strain induced in a thin lamella on a substrate caused by differential thermal expansion. The system undergoes a slow temperature change from 300K to sub-Kelvin levels. Are there specific modules, boundary conditions or studies in COMSOL that would be best suited for this scenario? Any insights on material properties or thermal stress analysis techniques would be greatly appreciated.
Thank you in advance for your guidance!
Hello Robert
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